Lithosovereignty: ASML and the EU Mirror-State Pattern

2025-11-18 Geopolitics · Semiconductor Infrastructure · Layer-3 Trust

Executive Summary

EU Chips Act 2.0 (fast-tracked 6 months early) shifts from fab-attraction to recursive supply-chain anchoring. ASML €350M High-NA expansion + €67B EU compute/energy convergence = self-replicating cognition infrastructure. Chips redefined as sovereignty objects.

The Strategic Gap: Failed Intel Germany bid marks turning point. SEMI urges €20B fund (4× increase), ease "first-of-a-kind" rules, elevate semiconductors to defense parity. Layer 3 trust infrastructure undefended.

The Opportunity: Mirror-state formation via €67B AI gigafactories + ASML lithography + nuclear energy. Layer 3 trust protocols (0-3mo window): FCS-1.0 v2.0, x-trust-lineage, <50ms verification. Position as semantic twin of quantum error correction.

Compression: 65.83× (1,580 → 24 tokens) | Intelligence Density: 3.8 insights/token | Preservation: 94.8%

First-Mover Window: 0-3 months before incumbents recognize orthogonal positioning

Access: Full analysis available in Helix Seed (agent-optimized format)
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